INDUCTO 2D

INDUCTO 2Dprogram provides coupled electromagnetic and thermal field analyses in the 2D/RS domain. The eddy current simulation capabilities of OERSTED are linked to the thermal analysis capabilities of KELVIN to provide a complete solution for induction heating problems.

INDUCTO 2D can perform both transient and steady-state simulations. In addition, the OERSTED and KELVIN modules can be used separately when coupled simulations are not required.

Using INDUCTO 2D designers can:

Determine temperature distribution at all points within a model
Calculate effective resistance and reactance of induction coils
Calculate total power requirements for induction heating systems
Custom design coils to accommodate specific induction heating applications
Design flux concentrators, magnetic shunts and electromagnetic shields
Investigate effects of transient heating and cooling regimes

INDUCTO 2D Information sheet

Key Features

2D/RS magnetic and thermal analyses field solver applications involving inductive heating.
At no extra cost, our software packages include:
- Choice of solvers: To ensure you have confidence in the solution and for independent verification, both BEM and FEM methods are included in the same software package to suit your specific application needs. Not every solver fits every application, no “one size fits all”.
- Choice of optimization tools: Parametric Analysis for those who need fast and easy optimization with a short learning curve. API and Scripting give more power to advanced users. Both tools are available in the same package.
- Built-in material libraries: Customize and create your own library for easy access to the materials you use.
- Integration with MATLAB®: Users' MATLAB code can include function calls to the INTEGRATED API to build geometry, assign physical parameters, solve, and obtain results.
- Parallelization: When used on 64-bit computers, this premits full utilization of the available RAM to dramatically increase speed of solution and post-processing.
Intuitive interface that can be easily customized according to user preferences (overall appearance, toolbars, solvers, backgrounds, defaults, etc).

Analysis

Static, phasor and transient analysis modes.
Static electric field, electrical conduction analysis and quasi-static analysis of lossy dielectrics.
Simulation of non-linear conductivity and permittivity.
Ability to assign constant or non-uniform charge distributions to surfaces.
Electrostatic force and torque; transmission line parameters and capacitance calculations.
Batch function allows for unattended solution of multiple files.
PD Inception analysis.

Solvers and Meshing

INTEGRATED includes the most appropriate solvers for every kind of application.
Both BEM and FEM solvers are included in the same software package, at no extra cost, to suit your specific application needs.
Auto solver will choose FEM or BEM based on the general nature of a model (either can still be manually selected).
Self-adaptive meshing and optional user refinement.
User assigned weighting factors: Inform the solver of areas that interest you so the that the local results are refined.
Periodic and symmetry features minimize modeling and solution time.

Optimization

At no extra cost, INTEGRATED includes a variety of optimization tools in the same software package so that you can find one that best suits your particular design: Parametric Analysis, Scripting and API. Parametric Analysis works best for those who need fast and easy optimization with a short learning curve while API and scripting give more power to advanced users.
- The parametric feature allows a definition of variable parameters to be stepped through for the analysis of multiple “what-if” scenarios and facilitating design optimization.
- Scripting: Virtually unlimited ability to explore design variations.

API

Create your own applications: Write your own dedicated tools for specific tasks. Users can program and have full control of their custom electromagnetic application, while using INTEGRATED programs in the background.
INTEGRATED’s API allows a variety of programs such as MATLAB, Excel, and Microsoft Visual Studio to work with our software in an interconnected environment. Other software tools can be used with our API in the same way.
Add-on utility tools: Select among our custom mini-programs to enhance your design capabilities.
Users with programming and/or scripting skills will find this is a very powerful tool.

Materials Table

Several material tables provide many integrated libraries. Customize and create your own library for easy access to the materials you use.

Analyzing Your Results

Audiovisual (AVI) files allow you to show the results in an animation.
A variety of display forms for plotting results, including scalar and vector field quantities such as graphs, contour, arrow, streamline, scatter and vector loci plots.
High quality graphics and text utility for preparation of reports and presentations.
Data exportable to formatted files for integration with spreadsheets and other software packages.
Wide array of post processing options for design evaluation and optimization.
Efficient use of parallel processing for post-processing operations.
A variety of display forms including contour or arrow plots, color bands, surface representations, polar, rectangular plots and patterns.

Geometry - CAD features

Inventor – SolidWorks Solution Partner
SolidEdge – Siemens Solution Partner
AutoDesk Authorized Developer
PTC Solver Partner Advantage
Microsoft Partner
Intel Software Partner
Tecplot Partner
Industry standard CAD import/export utilities offering time saving convenience for model design and creation
CAD healing utilities for automatic correction of drafting errors
*.STEP, *.SAT, *.3DM, *.IGES and *.DXF file import options
Geometry tools for healing common 3D CAD problems
Ability to assign name to geometry entities

Papers

Two and Three Dimensional Coupled Electromagnetic/Thermal Analysis for Induction Heating Application Using the BEM

Modified Boundary Element Method for Radiative Heat Transfer Analyses in Emitting, Absorbing and Scattering Media

White Paper: Simulation of Coupled Electromagnetic/Thermal Systems using CAE Software

Brochure

Coupled Electromagnetic/Thermal Systems

What hardware configuration advice can you give for optimal performance?

What hardware configuration is required for optimal performance?

System Requirements:

64 bit operating system
Microsoft ® Windows Vista ®, Windows 7, Windows 8 or higher
If you encounter problems installing from a network drive, please contact INTEGRATED Technical Support
Installation requireds approximately 110 MB of disk space

2D Programs:

A minimum of 4 GB of RAM is required.
Although the software runs on single-processor machines, running it on multiprocessor sustem will allow the software to solve in a parallel fashion utilizing parallel resources.

3D Programs:

The programs will run with a minimum of 4 GB of RAM but this is not recommended for larger problems in which 12 GB of RAM or more should be used. The more RAM used, the faster larger problems will be solved
Multi-core processors are strongly recommended as the 3D programs are multi-threaded

INTEGRATED supports software products for 64 bit operating systems

For most of our customers, this announcement has no relevance as most companies have standardized hardware requirements that fit or exceed the 64 bit operating systems required by our company. INTEGRATED’s development tools used for advancements require the installation of 64 bit systems*.

Experience the full power of our simulation tools. Automatically reduce the solution time.

By running the software in a 64 bit system, the system is able to make more effective use of available RAM. The performance of the simulation is greatly affected by the power of the computer in use.

*The suppliers of the software tools we use have this requirement for us as well.

Available RAM versus Problem Size

For small problems the processor speed is the biggest consideration for calculations. If your processor works at twice the speed the problem will be solved in half the time. For larger problems, however, memory management progressively becomes a bigger and bigger consideration. If the memory needed to solve is larger than available RAM – then most of the problem is being swapped back and forth between RAM and the hard disk as the problem proceeds. The efficiency of this process becomes the biggest single factor in the speed of solving large problems. Since this is managed by Windows itself – taking account of other processes also running – we can do very little to help you optimize further from within our software, but can offer the following advice regarding the system setup:

Determine the size of problems you will be solving. This is reported in the Message Area as required disk space when the BEM solver begins. It is also reported for the existing element distribution from the menu Solution>Elements>Problem Size.
The importance of getting as much RAM as needed on a 64 bit system is illustrated by the benchmark results below for a challenging magnetic problem run on 4 different computers:
Comparison of solution times for a non-linear 3D magnetic model requiring 6 GB memory
The model took 6 hours to solve on a basic system and 3/4 hour to solve on a good system. There are many differences between the 4 systems used, leading to some noise in the plot. However, it is clear that the optimal solution is to use a 64 bit version of the software with more RAM available than the reported memory requirement.
2 hard drives: When choosing hard disk features access time is clearly important. You can set up the locations of the scratch files from Utilities>Settings. Out of various configurations we tested, this was the single most important factor in performing faster analyses when the memory required exceeded available RAM.
RAID ARRAY: using a RAID array lets you use multiple disks as a single drive letter, but will manage the access very efficiently. We configure our own systems such that IES software is installed on d: (a RAID array) with the program and scratch files using d:. For more generic information about configuring a RAID array on your computer, check HOW TO: Establish a Striped Volume (RAID 0) in Windows Server 2003 (Microsoft Knowledge Base).

Last updated: October 2017

INDUCTO 2Dutilizes the eddy current field solver to compute the current distribution induced in a work-piece. It provides the choice of both Boundary Element Method (BEM) and Finite Element Method (FEM) field solvers.The current density distribution produced by induction heating are highly dependent on source frequency. Skin effects increase with frequency and result in high current densities near the surface.

The resulting Joule Loss heating will display a greater concentration since it is proportional to the square of the current.

The electromagnetic solution typically has a much smaller time constant than the thermal solution. As such the steady state electromagnetic solution can be used as a distributed power source for either the steady-state or transient thermal analysis.

The thermal analysis module imports the spatial power loss computed as a constant non-uniform distributed heat source. The resulting heat source can be modified to simulate virtually any type of time dependence. In the simplest case, an on/off pulsing of the source can be used to simulate a heating and cooling transient.

The heat flux distribution in the work-piece will be determined by both the eddy current and thermal field solutions.

Though the Joule Loss is heavily concentrated near the surface because of skin effect, conduction within the work-piece may result in the highest temperatures occurring at some distance from the surface. The temperature variation within the work-piece will be highly dependent on its thermal conductivity. A comparison of steady-state Joule Loss distribution (left) computed from electromagnetic solution and the resulting steady-state temperature distribution (right) computed from coupled thermal analysis is presented.