CELSIUS
Temperature distribution in
coffee cup
CELSIUS is a 3D thermal analysis program for applications like:
- Cooling fins
- Heat sinks
- Chip packaging
- Appliances
- Aerospace and automotive components
- Motor cooling
Fast and accurate, CELSIUS displays temperature, heat flux and temperature gradients using
graphs and contour, profile or arrow plots.
Our powerful parametric solvers allow designers to automatically vary and experiment with geometry, materials and
sources – reducing the tedious, repetitive task of fine–tuning multiple design parameters.
Request your CELSIUS evaluation
- Easily assign boundary conditions such as temperature, heat flux, temperature gradient,
convective and radiative heat exchange
- Assign heat sources in the form of volume heat and surface heat
- Material table stores thermal conductivity, specific heat, mass density or absorption and
scattering coefficients
Heat sink temperature distribution
Ask for a live, interactive Internet demonstration of CELSIUS
CELSIUS reduces design time while improving product performance by letting you
design via computer simulations thereby reducing costs and risks associated with physical prototyping.
Easy-to-learn, CELSIUS lets you
focus on product development, not software training.
Download CELSIUS Product Sheet
Two and Three Dimensional Coupled Electromagnetic/Thermal Analysis for Induction Heating Application Using the BEM
Modified Boundary Element Method for Radiative Heat Transfer Analyses in Emitting, Absorbing and Scattering Media
System requirements and recommendations
