Products
IES' accurate field solvers, easy-to-use Windows GUI, powerful post-processing
and the best service and support in the industry help you:
REDUCE DESIGN TIME & COST: Take risks with
simulation, not prototyping or manufacturing.
IMPROVE PRODUCT PERFORMANCE: Fast, accurate calculations
and a link to CAD packages for true representation of complex geometric shapes.
DECREASE TIME TO MARKET: A parametric solver reduces the
tedious, repetitive task of fine-tuning multiple design parameters.
INCREASE PROFITS: Easy to learn programs let
you focus on product development, not software training.
IES also allows you to choose from a Boundary Element Method
(BEM) only, Finite Element Method (FEM) only or Hybrid
BE-FE Method solver.
ELECTRIC FIELDS
ELECTRO - 2D/RS solutions
COULOMB - 3D solutions
Analyze electric fields in applications ranging from electrical stress on high voltage equipment
to power supplies and pulsed power systems. |
PARTICLE TRAJECTORY ANALYSIS
LORENTZ - 2D/RS and 3D solutions
Calculate the path of charged particles or beams of particles through electric and magnetic
fields in applications like CRT’s, electron microscopes, X-ray tubes and IMS. |
MAGNETIC FIELDS
MAGNETO - 2D/RS solutions
AMPERES - 3D solutions
Analyze magnetic fields in applications including motors, solenoids, magnetic recording devices,
sensors and magnetrons. |
FULL-WAVE HIGH FREQUENCY
SINGULA - 3D solutions
Analyze radiating and scattering devices with parameters such as antenna radiation patterns,
radar cross-section and power absorption. |
EDDY CURRENTS
OERSTED - 2D/RS solutions
FARADAY - 3D solutions
Analyze eddy currents or skin effects in electromagnetic applications including three-phase
motors, non-destructive test systems, induction heating and hardening systems and RFID systems. |
THERMAL AND STRUCTURAL
KELVIN - 2D/RS Thermal solutions
CELSIUS - 3D Thermal solutions
ELASTO - 2D/RS Structural solutions
Stand-alone thermal and structural packages complement your electromagnetic analysis software.
Use the electromagnetic power loss or force output as input for your thermal and structural
analysis. |
POWER ELECTRONICS
CASPOC
Model power electronics, electrical machines, load and control in one multilevel model. |
IES IMPORT
IES IMPORT
Import utility for IES users with CAD and CAE programs. |
Request your FULL-VERSION software evaluation package today!
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